SEMICONDUCTOR DEVICE WITH ELECTRIC COMPONENT IN CIRCUIT BOARD

• Main Author: NAGAI SHOHEI
• Format: Patent
• Language: English; Japanese
• Published: 13.10.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a semiconductor device incorporating an electric component in a circuit board, and having improved thermal conductivity and mechanical characteristic in a substrate main body while keeping insulating of the electric component.SOLUTION: A semiconductor device includes a substrate main body 12 having a first surface 12a and a second surface 12b, electric components 21, 22, 31, and 32 disposed in the substrate main body, a surface conductor pattern 70 provided in a circuit layer L6 present on the second surface, a first internal conductor pattern 68 and a second internal conductor pattern 69 provided in a circuit layer L5 existing between the electric component and the second surface and insulated from each other, at least one first heat conductive veer 77 extending from the electric component to the first internal conductor pattern, and at least one second heat conductive veer 78a, 78b extending from the surface conductor pattern to the second internal conductor pattern.SELECTED DRAWING: Figure 3 【課題】回路基板内に電気部品を内蔵する半導体装置において、電気部品の絶縁性を維持しつつ、基板本体における熱伝導性と機械的特性とを向上する。【解決手段】半導体装置は 、第１面１２ａ及び第２面１２ｂを有する基板本体１２と、基板本体内に配置された電気部品２１、２２、３１、３２と、前記第２面上に位置する回路層Ｌ６に設けられた表面導体パターン７０と、前記電気部品と前記第２面との間に位置する回路層Ｌ５に設けられ、互いに絶縁された第１内部導体パターン６８及び第２内部導体パターン６９と、前記電気部品から前記第１内部導体パターンまで延びる少なくとも一つの第１伝熱ビア７７と、前記表面導体パターンから第２内部導体パターンまで延びる少なくとも一つの第２伝熱ビア７８ａ、７８ｂとを備える。【選択図】図３