SUPPORT SHEET, COMPOSITE SHEET FOR RESIN FILM FORMATION, KIT AND METHOD FOR MANUFACTURING RESIN FILM-ATTACHED CHIP

• Main Authors: KOMASU YUICHIRO, SATO MIREI, KOBASHI RIKIYA
• Format: Patent
• Language: English; Japanese
• Published: 12.10.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

To provide a support sheet which allows a short seasoning period of a sticker layer to be kept, and which can eliminate a failure of delamination between a sticker layer and a base material of the support sheet, a composite sheet and a kit, for forming a resin film including the support sheet and a resin film-forming layer, and a method for manufacturing a resin film-attached chip.SOLUTION: A support sheet 10 comprises a sticker layer 12 provided on a base material 11, which is to be used in a method for manufacturing a resin film-attached chip 901. The sticker layer 12 is formed by coating a sticker composition containing an acrylic resin having a hydroxyl group and an isocyanate-based crosslinking agent. The proportion of the isocyanate-based crosslinking agent blended to one equivalent of the hydroxyl group of the acrylic resin is 0.07 eq. or more. The isocyanate-based crosslinking agent contains tolylene diisocyanate and hexamethylene diisocyanate. The proportion of the hexamethylene diisocyanate blended to one pt.mass of the tolylene diisocyanate is 0.3-4.0 pts.mass.SELECTED DRAWING: Figure 6D 【課題】粘着剤層のシーズニング期間を短く保ち、支持シートの粘着剤層と基材との間で剥がれ不良をなくすことができる支持シート、前記支持シート及び樹脂膜形成層を備える樹脂膜形成用複合シート及びキット、並びに樹脂膜付きチップの製造方法の提供。【解決手段】樹脂膜付きチップ９０１の製造方法に用いられる基材１１上に粘着剤層１２が設けられた支持シート１０であり、粘着剤層１２が水酸基を有するアクリル樹脂及びイソシアネート系架橋剤を含有する粘着剤組成物を塗布して形成されるものであり、前記アクリル樹脂の水酸基１当量に対する前記イソシアネート系架橋剤の配合割合は０．０７当量以上であり、前記イソシアネート系架橋剤はトリレンジイソシアネート及びヘキサメチレンジイソシアネートを含有し、トリレンジイソシアネート１質量部に対する前記ヘキサメチレンジイソシアネートの配合割合は０．３～４．０質量部である。【選択図】図６Ｄ