BONDING STRUCTURE FOR CONDUCTORS AND ULTRASONIC BONDING METHOD FOR CONDUCTORS

To provide a bonding structure for conductors and an ultrasonic bonding method for conductors that can suppress generation of burrs and perform ultrasonic bonding of conductors.SOLUTION: A conductor 15 is formed by intertwisting a plurality of wires. In order to perform ultrasonic bonding, first, an...

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Bibliographic Details
Main Authors YAMADA TAKUO, IKUNUMA YOSHIKI
Format Patent
LanguageEnglish
Japanese
Published 21.09.2022
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
CURRENT COLLECTORS
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRICITY
GENERATION
INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES
LINE CONNECTORS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:To provide a bonding structure for conductors and an ultrasonic bonding method for conductors that can suppress generation of burrs and perform ultrasonic bonding of conductors.SOLUTION: A conductor 15 is formed by intertwisting a plurality of wires. In order to perform ultrasonic bonding, first, an aggregate obtained by aggregating conductors 15a, 15b of a plurality of electric wires is arranged between an anvil 7 and a hone 5 opposite in a vertical direction. Gathers 9 are arranged on both sides of the aggregate of the conductors 15a, 15b. Subsequently, with the gathers 9 sandwiching and regulating the aggregate in a width direction, ultrasonic vibration is applied to the aggregate from the hone 5 while the aggregate is sandwiched by the anvil 7 and the hone 5 in the vertical direction and is collectively applied with a pressure. In this case, a diameter of a wire 19a arranged at an alignment part of the anvil 7 and the gather 9 and a wire 19b arranged at an alignment part of the hone 5 and the gather 9 is greater than a diameter of at least some wires 19b arranged in another parts.SELECTED DRAWING: Figure 2 【課題】 バリの発生を抑制して導体同士を超音波接合することが可能な導体の接合構造および導体の超音波接合方法を提供する。【解決手段】 導体１５は、複数の素線が撚り合わせられて構成される。超音波接合を行うためには、まず、複数の電線の導体１５ａ、１５ｂを集合させた集合体を、上下方向に対向するアンビル７とホーン５との間に配置する。また、導体１５ａ、１５ｂの集合体の両側にはギャザー９が配置される。次に、集合体の幅方向をギャザー９で挟み込んで規制した状態で、上下方向からアンビル７とホーン５とで集合体を挟んで一括して加圧しながら、ホーン５から集合体に超音波振動を与える。この際、アンビル７とギャザー９との合わせ部に配置される素線１９ａと、ホーン５とギャザー９との合わせ部に配置される素線１９ｂの径が、他の部位に配置される少なくとも一部の素線１９ｂの径よりも大きい。【選択図】図２
Bibliography:Application Number: JP20210036338