MEMORY SYSTEM

To provide a memory system that achieves improved reliability.SOLUTION: According to the embodiment, a memory system includes a semiconductor storage device 100 and a memory controller 200 that controls a read operation in the semiconductor storage device. The semiconductor storage device includes f...

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Bibliographic Details
Main Authors YAMADA HIDEKI, SHIRAKAWA MASANOBU
Format Patent
LanguageEnglish
Japanese
Published 11.03.2022
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Summary:To provide a memory system that achieves improved reliability.SOLUTION: According to the embodiment, a memory system includes a semiconductor storage device 100 and a memory controller 200 that controls a read operation in the semiconductor storage device. The semiconductor storage device includes first and second memory cells MC0 stacked on a substrate, a word line WL0 connected to the first and second memory cells, a first bit line BL0 connected to the first memory cell, and a second bit line BL1 connected to the second memory cell. The read operation of a first state ("A") includes first and second read operations for reading data from the first and second memory cells, respectively. A first read voltage VA0 is applied to the word line during a first period in which the first read operation is performed, and a second read voltage VA1 is applied to the word line during a second period in which the second read operation is performed.SELECTED DRAWING: Figure 14 【課題】信頼性を向上する。【解決手段】実施形態によれば、メモリシステムは、半導体記憶装置100と、半導体記憶装置における読み出し動作を制御するメモリコントローラ200とを含む。半導体記憶装置は、基板の上方に積層された第1及び第2メモリセルMC0と、第1及び第2メモリセルに接続されたワード線WL0と、第1メモリセルに接続された第1ビット線BL0と、第2メモリセルに接続された第2ビット線BL1とを含む。第1ステート("A")の読み出し動作は、第1及び第2メモリセルのデータをそれぞれ読み出す第1及び第2読み出し動作を含む。第1読み出し動作を行う第1期間に、ワード線に第1読み出し電圧VA0が印加され、第2読み出し動作を行う第2期間に、ワード線に第2読み出し電圧VA1が印加される。【選択図】図14
Bibliography:Application Number: JP20200146732