RESIN COMPOSITION AND RESIN MOLDING MADE OF THE RESIN COMPOSITION
To provide a resin composition that has a low dielectric loss tangent, and can obtain a resin molding excellent in the mechanical strength such as toughness.SOLUTION: A resin composition comprising (A) a liquid crystal polyester resin having the following composition and (B) at least one kind of a f...
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Format | Patent |
Language | English Japanese |
Published |
17.01.2022
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Abstract | To provide a resin composition that has a low dielectric loss tangent, and can obtain a resin molding excellent in the mechanical strength such as toughness.SOLUTION: A resin composition comprising (A) a liquid crystal polyester resin having the following composition and (B) at least one kind of a filler selected from the group consisting of silica, mica, and talc, in which the dielectric tangent measured according to a cavity resonator perturbation method at a measurement frequency 10 GHz is 1.0×10-3 or smaller. Liquid polyester resin (A): 40 mol% or larger and 75 mol% or smaller of a structural unit (I) derived from 6-hydroxy-2-naphthoic acid, 12 mol% or larger and 30 mol% or smaller of the structural unit (II) derived from an aromatic diol compound, and 12 mol% or larger and 30 mol% or smaller of the structural unit (III) derived from an aromatic dicarboxylic acid compound containing a structural unit (IIIA) derived from terephthalic acid and/or a structural unit (IIIB) derived from 2,6-naphthalene dicarboxylic acid.SELECTED DRAWING: None
【課題】低誘電正接であり、かつ、靭性等の機械強度性に優れる樹脂成形品が得られる樹脂組成物を提供する。【解決手段】下記の組成の液晶ポリエステル樹脂(A)と、シリカ、マイカ、およびタルクからなる群から選択される少なくとも1種であるフィラー(B)からなり、測定周波数10GHzにおける空洞共振器摂動法で測定した誘電正接が1.0×10-3以下であることを特徴とする樹脂組成物。液晶ポリエステル樹脂(A):6-ヒドロキシ-2-ナフトエ酸に由来する構成単位(I)40モル%以上75モル%以下、芳香族ジオール化合物に由来する構成単位(II)12モル%以上≦30モル%以下、テレフタル酸に由来する構成単位(IIIA)および/または2,6-ナフタレンジカルボン酸に由来する構成単位(IIIB)を含む芳香族ジカルボン酸化合物に由来する構成単位(III)12モル%以上≦30モル%以下。【選択図】なし |
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AbstractList | To provide a resin composition that has a low dielectric loss tangent, and can obtain a resin molding excellent in the mechanical strength such as toughness.SOLUTION: A resin composition comprising (A) a liquid crystal polyester resin having the following composition and (B) at least one kind of a filler selected from the group consisting of silica, mica, and talc, in which the dielectric tangent measured according to a cavity resonator perturbation method at a measurement frequency 10 GHz is 1.0×10-3 or smaller. Liquid polyester resin (A): 40 mol% or larger and 75 mol% or smaller of a structural unit (I) derived from 6-hydroxy-2-naphthoic acid, 12 mol% or larger and 30 mol% or smaller of the structural unit (II) derived from an aromatic diol compound, and 12 mol% or larger and 30 mol% or smaller of the structural unit (III) derived from an aromatic dicarboxylic acid compound containing a structural unit (IIIA) derived from terephthalic acid and/or a structural unit (IIIB) derived from 2,6-naphthalene dicarboxylic acid.SELECTED DRAWING: None
【課題】低誘電正接であり、かつ、靭性等の機械強度性に優れる樹脂成形品が得られる樹脂組成物を提供する。【解決手段】下記の組成の液晶ポリエステル樹脂(A)と、シリカ、マイカ、およびタルクからなる群から選択される少なくとも1種であるフィラー(B)からなり、測定周波数10GHzにおける空洞共振器摂動法で測定した誘電正接が1.0×10-3以下であることを特徴とする樹脂組成物。液晶ポリエステル樹脂(A):6-ヒドロキシ-2-ナフトエ酸に由来する構成単位(I)40モル%以上75モル%以下、芳香族ジオール化合物に由来する構成単位(II)12モル%以上≦30モル%以下、テレフタル酸に由来する構成単位(IIIA)および/または2,6-ナフタレンジカルボン酸に由来する構成単位(IIIB)を含む芳香族ジカルボン酸化合物に由来する構成単位(III)12モル%以上≦30モル%以下。【選択図】なし |
Author | UMEMURA YUJI ONO NOZOMI |
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DocumentTitleAlternate | 樹脂組成物および該樹脂組成物からなる樹脂成形品 |
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Snippet | To provide a resin composition that has a low dielectric loss tangent, and can obtain a resin molding excellent in the mechanical strength such as... |
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SubjectTerms | APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBONFILAMENTS CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS,THREADS, FIBRES, BRISTLES OR RIBBONS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY NATURAL OR ARTIFICIAL THREADS OR FIBRES ORGANIC MACROMOLECULAR COMPOUNDS SPINNING TEXTILES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
Title | RESIN COMPOSITION AND RESIN MOLDING MADE OF THE RESIN COMPOSITION |
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