PHENOLIC COMPOUND, PHENOLIC CURATIVE, THERMOSETTING RESIN COMPOSITION, AND PHENOLIC COMPOUND PRODUCTION METHOD

• Main Author: KASHINO TOMOMASA
• Format: Patent
• Language: English; Japanese
• Published: 27.12.2021
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a phenolic compound than can form a thermosetting resin composition excellent in handleability and can form a cured product excellent in thermal conductivity and heat resistance.SOLUTION: A phenolic compound is represented by the general formula (1) in the figure. (In the general formula (1), R and Q each independently represent a hydrogen atom, C1-6 alkyl group, or C1-6 alkoxy group, where multiple occurrences of R or multiple occurrences of Q may be identical or different.)SELECTED DRAWING: None 【課題】ハンドリング性に優れた熱硬化性樹脂組成物を得ることができ、さらに熱伝導性および耐熱性に優れた硬化物を得ることができるフェノール化合物を提供する。【解決手段】本発明のフェノール化合物は、下記一般式（１）で表される。（一般式（１）中、ＲおよびＱは、それぞれ独立して、水素原子、炭素数１〜６のアルキル基、または炭素数１〜６のアルコキシ基を示す。複数存在するＲまたは複数存在するＱは同一でも異なっていてもよい。）【選択図】なし