BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEM AND METHOD FOR WAFER PROCESSING SYSTEM

To provide a workpiece holder which is subjected to spatially tailored processing.SOLUTION: A workpiece holder includes: a puck 200; an inner resistance heater 220-1 and an outer resistance heater 220-2 in thermal communication with an inner portion 212 and an outer portion 214 of the puck, respecti...

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Bibliographic Details
Main Authors DAVID BENJAMINSON, ANANDA SEELAVANTH MATH, SHUBHAM CHOUREY, DMITRY LUBOMIRSKY, SARAVANAKUMAR NATARAJAN
Format Patent
LanguageEnglish
Japanese
Published 09.12.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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