BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEM AND METHOD FOR WAFER PROCESSING SYSTEM

• Main Authors: DAVID BENJAMINSON, ANANDA SEELAVANTH MATH, SHUBHAM CHOUREY, DMITRY LUBOMIRSKY, SARAVANAKUMAR NATARAJAN
• Format: Patent
• Language: English; Japanese
• Published: 09.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a workpiece holder which is subjected to spatially tailored processing.SOLUTION: A workpiece holder includes: a puck 200; an inner resistance heater 220-1 and an outer resistance heater 220-2 in thermal communication with an inner portion 212 and an outer portion 214 of the puck, respectively; and a thermal sink 230 in thermal communication with the puck. The inner resistance heater and the outer resistance heater can be controlled individually, and are in greater respective degrees of thermal communication with the puck, than a degree of thermal communication of the thermal sink with the puck. A method for controlling the temperature distribution of a workpiece includes: flowing a heat exchange fluid trough a thermal sink to provide a reference temperature to a puck; raising temperatures of a radially inner portion and a radially outer portion of the puck to a first temperature and a second temperature, respectively, each higher than the reference temperature, by activating first and second heating devices disposed in thermal communication with the radially inner portion and the radially outer portion of the puck, respectively; and placing the workpiece on the puck.SELECTED DRAWING: Figure 3 【課題】空間的に適切化処理された被加工物ホルダを提供する。【解決手段】被加工物ホルダは、パック２００と、パックの内側部分２１２及び外側部分２１４の夫々と熱連通する内側抵抗ヒータ２２０−１及び外側抵抗ヒータ２２０−２と、パックと熱連通する熱シンク２３０とを含む。内側抵抗ヒータと外側抵抗ヒータは、個別に制御可能であり、かつ、熱シンクとパックとの熱連通よりも高い度合いで、パックと熱連通する。被加工物の温度分布を制御する方法は、パックに対する基準温度を確立するために、熱シンクを通して熱交換流体を流すことと、パックの径方向内側部分及び径方向外側部分とそれぞれ熱連通するように配置された第１及び第２の加熱デバイスを作動させることによって、基準温度よりも高い第１温度及び第２温度まで、パックの径方向内側分及び径方向外側部分の温度を上昇させることと、パック上に被加工物を置くこととを、含む。【選択図】図３