METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

• Main Authors: TANAKA MASAJI, FUJIWARA MASAKAZU
• Format: Patent
• Language: English; Japanese
• Published: 01.11.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a method for manufacturing an electronic component that can prevent many voids from remaining in a sealant in a sealing step, is excellent in reliability, and can achieve weight reduction.SOLUTION: A method for manufacturing an electronic component comprising a substrate, components that are provided on the substrate, and a sealant that covers the substrate and components and is formed of a cured product of a resin sheet, and the method for manufacturing an electronic component includes: a first step of peeling off one mold release film provided on the resin sheet, arranging a surface of the resin sheet from which the mold release film is peeled off on the substrate provided with the components, and peeling off a mold release film provided on a surface of the resin sheet on the opposite side of the surface arranged on the substrate; a second step of pressing, with an elastic resin plate, on the resin sheet arranged on the substrate in the first step to temporarily fix the resin sheet and the substrate and components; and a third step of heating and curing the resin sheet temporarily fixed with the substrate and components in the second step to seal the substrate and components.SELECTED DRAWING: None 【課題】封止工程において封止材中にボイドを残りにくくすることができ、信頼性に優れるとともに軽量化を図ることができる電子部品の製造方法を提供する。【解決手段】基板と、前記基板上に設けられた部品と、前記基板及び部品を被覆する樹脂シートの硬化物からなる封止材とを備えた電子部品の製造方法であって、樹脂シートに設けられた一方の離型フィルムを剥がし、前記樹脂シートの離型フィルムを剥がした面を部品が設けられた基板上に配置し、前記樹脂シートの基板に配置した面とは反対側の面に設けられた離型フィルムを剥がす第一工程と、前記第一工程で基板上に配置した樹脂シート上から弾性樹脂板により押圧し、前記樹脂シートと前記基板及び部品とを仮固定する第二程と、前記第二工程で前記基板及び部品と仮固定した樹脂シートを加熱、硬化して前記基板及び部品を封止する第三工程とを有する、電子部品の製造方法。【選択図】なし