SURFACE GRINDING DEVICE

To provide a surface grinding device enabling efficient and highly accurate grinding of a placoid workpiece made of hard brittle material such as SiC, GaN, sapphire, and diamond.SOLUTION: A surface grinding device comprises: a work table 41 that fixes a bottom surface of a placoid workpiece W to an...

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Bibliographic Details
Main Authors UEHARA YUKIO, MITSUI TAKAHIKO, IDE SATORU, YAMAMOTO EIICHI
Format Patent
LanguageEnglish
Japanese
Published 13.09.2021
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:To provide a surface grinding device enabling efficient and highly accurate grinding of a placoid workpiece made of hard brittle material such as SiC, GaN, sapphire, and diamond.SOLUTION: A surface grinding device comprises: a work table 41 that fixes a bottom surface of a placoid workpiece W to an adsorption surface and rotates around a longitudinal axis perpendicular to the adsorption surface; a first grindstone that grinds, with the circumferential surface 12 thereof, a flat surface of the workpiece on the rotating work table while rotating the grindstone around a first grinding quadrature axis 11; and a second grindstone 20 that grinds, with the circumferential surface 21 thereof, the flat surface of the workpiece on the rotating work table while rotating the grindstone around a second grinding quadrature axis. The workpiece is ground with the second grindstone after being ground with the first grindstone. As a result, a large-diameter hard-brittle substrate can be ground with a high degree of accuracy, and the size of the substrate can be increased. Rough grinding and fine grinding can be performed without removing the workpiece, so that the machining time can be shortened resulting in improvement of productivity.SELECTED DRAWING: Figure 1 【課題】ＳｉＣ、ＧａＮ、サファイア、ダイヤモンド等の硬脆性材料からなる板状の加工物を効率良く高精度に研削することができる平面研削装置を提供する。【解決手段】吸着面に板状の加工物Ｗの底面を固定して吸着面に垂直な縦軸を中心として回転するワークテーブル４１と、回転しているワークテーブル上の加工物の平面を第１の研削横軸を中心として回転しながら円周面１２で研削する第１の研削といし１１と、回転しているワークテーブル上の加工物の平面を第２の研削横軸を中心として回転しながら円周面２１で研削する第２の研削といし２０と、を具備し、第１の研削といしで加工物を研削した後に第２の研削といしで加工物を研削する。これにより、大径の硬脆性基板を高精度に研削することができ、基板の大型化を図ることができる。加工物を取り外すことなく粗研削と精研削を実行でき、加工時間を短縮して生産性を向上させることができる。【選択図】図１
Bibliography:Application Number: JP20200028757