SUBSTRATE HOLDING APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

To facilitate lifting and lowering of a chuck and gripping and releasing of a substrate by the chuck.SOLUTION: A chuck base 11 mounts thereon, a chuck 12 having a gripping portion 121. A substrate W is gripped by the gripping portion 121 and rotated by the chuck base 11. A first drive magnet 201 and...

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Bibliographic Details
Main Author NAKAI HITOSHI
Format Patent
LanguageEnglish
Japanese
Published 01.07.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To facilitate lifting and lowering of a chuck and gripping and releasing of a substrate by the chuck.SOLUTION: A chuck base 11 mounts thereon, a chuck 12 having a gripping portion 121. A substrate W is gripped by the gripping portion 121 and rotated by the chuck base 11. A first drive magnet 201 and a first driven magnet 202 move the chuck 12 between a first position and a second position. A second drive magnet 501 and a second driven magnet 35 cause the chuck 12 to transition between first and second positions.SELECTED DRAWING: Figure 3 【課題】チャックの昇降と、チャックによる基板の把持およびその解除との容易化。【解決手段】把持部１２１を有するチャック１２をチャックベース１１が搭載する。基板Ｗは把持部１２１に把持されてチャックベース１１によって回転する。第１駆動磁石２０１と第１従動磁石２０２とによってチャック１２は第１位置と第２位置との間で移動する。第２駆動磁石５０１と第２従動磁石３５とによってチャック１２は第１姿勢と第２姿勢との間を遷移する。【選択図】図３
Bibliography:Application Number: JP20190231680