MANUFACTURING METHOD OF MULTILAYER WIRING BOARD

• Main Authors: SHINOHARA SHO, SHINADA EIITSU
• Format: Patent
• Language: English; Japanese
• Published: 27.05.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a manufacturing method in which short-circuiting with another connection pad does not occur by preventing conductive paste from protruding from a connection pad when manufacturing a multilayer wiring board in a penetration through hole-less structure using the paste.SOLUTION: The present invention relates to a manufacturing method of a multilayer wiring board structured by stacking a plurality of wiring boards each including an electrical connection pad and electrically connecting the wiring boards with each other. The manufacturing method of the multilayer wiring board includes: adhering insulation films to both opposed faces of the wiring boards; performing boring of the insulation film in such a manner that the electrical connection pad is exposed from the face to which the insulation film is adhered, to a position of the electrical connection pad; forming a connection hole of the wiring board; forming a bump which protrudes in a convex shape, by filling the connection hole of any one face with conductive paste; accommodating the bump of the conductive paste in the connection hole of the other face; and performing the boring in such a manner that an outer diameter of the bump of the conductive paste becomes smaller than a hole diameter of the connection hole in which the bump of the conductive paste is accommodated.SELECTED DRAWING: Figure 1 【課題】導電性ペーストを用いた貫通スルーホールレス構造の多層配線板を製造する際に、ペーストが接続パッドからはみ出すことなく、他の接続パッドとの間で短絡を引き起こすことのない製造方法を提供する。【解決手段】電気的接続パッドを有する複数枚の配線板を積層し、該配線板同士を電気的に接続する構造の多層配線板製造方法において、前記配線板同士の対向する面の両方に絶縁フィルムを貼付し、前記絶縁フィルムを貼付した面から前記電気的接続パッドの位置に前記電気的接続パッドが露出するように、前記絶縁フィルムの穴明けを行い、配線板の接続穴を形成し、いずれか一方の面の接続穴に導電性ペーストを充填し凸状に突出したバンプを形成し、他方の面の接続穴に、前記導電性ペーストのバンプを収容し、前記導電性ペーストのバンプの外径が、前記導電性ペーストのバンプを収容する接続穴の穴径よりも小さくなるよう穴明けを行う多層配線板の製造方法。【選択図】 図１