POLYAMIDE RESIN COMPOSITION FOR SEMICONDUCTOR TRAY

• Main Authors: PARK BONG JOO, CHA SOON YOUNG, PARK SI JUN
• Format: Patent
• Language: English; Japanese
• Published: 18.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide: a resin composition which has excellent moldability as well as conductivity and is capable of maintaining dimensional stability before and after the resin composition is subjected to a cooling process after injection or extrusion and is continuously exposed to high-temperature environment; and a novel polyamide resin composition which does not cause dust due to the tray-to-tray friction because processed semiconductor trays have uniform surfaces.SOLUTION: A polyamide resin composition includes a polyamide-based matrix resin, an amorphous polyamide resin, a crystalline polyphthalamide resin, carbon fibers, and glass fibers, where the polyamide-based matrix resin is selected from nylon 6, nylon 66, or a mixture thereof. The polyamide resin composition has a warpage A1+A2 of 10 or less, as measured after an injection-molded specimen with 230 mm×150 mm×1.8 mm is controlled to be maintained at a temperature of 23±2°C and a relative humidity of 50±5% for 24 hours.SELECTED DRAWING: Figure 1 【課題】伝導性を有しているとともに、成形性に優れ、射出や押出の後、冷却過程と高温環境への継続した露出の前、後に、寸法安定性を維持することができる樹脂組成物、および、加工された半導体トレイの表面が均一で、トレイ間の摩擦による粉塵の発生がない新たなポリアミド樹脂組成物の提供。【解決手段】ナイロン６、ナイロン６６またはこれらの混合物から選択されるポリアミド系マトリックス樹脂、非晶性ポリアミド樹脂、結晶性ポリフタルアミド樹脂、炭素繊維およびガラス繊維を含むポリアミド樹脂組成物。２３０×１５０×１．８ｍｍの射出成形された試験片を、温度２３±２℃、相対湿度５０±５％で２４時間維持するように調節した後、測定した反りＡ１＋Ａ２が１０以下である、前記ポリアミド樹脂組成物。【選択図】図１