SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

• Main Author: NAKAI HITOSHI
• Format: Patent
• Language: English; Japanese
• Published: 11.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a substrate processing device and a substrate processing method with which it is possible to efficiently suppress the contamination of a substrate due to the collision of a process liquid ejected from the substrate against peripheral members.SOLUTION: An outside annular member 13 has an u...