LASER PROCESSING DEVICE AND OPTICAL ADJUSTMENT METHOD

• Main Authors: YOKOYAMA JUN, TAKECHI YOHEI
• Format: Patent
• Language: English; Japanese
• Published: 01.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DEVICES USING STIMULATED EMISSION; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To enable spot positions of a plurality of laser light with different output differences to be positioned with high accuracy and at high speed.SOLUTION: A laser processing device emits processing light, measurement light, guide light for processing and guide light for measurement which are emitted to a surface of a work-piece. Respective wavelengths of the guide light for processing and the guide light for measurement are set to wavelengths in which an amount of shift of an emission position of the guide light for processing from an emission position of the guide light for measurement caused by chromatic aberration of magnification of a lens is equal to an amount of shift of an emission position of the processing light from an emission position of the measurement light caused by the chromatic aberration of magnification of the lens.SELECTED DRAWING: Figure 7 【課題】出力差が異なる複数のレーザ光のスポット位置の位置合わせを高精度かつ高速に実現すること。【解決手段】レーザ加工装置は、被加工物の表面に照射される加工光、測定光、加工用ガイド光、および測定用ガイド光を出射する。加工用ガイド光および測定用ガイド光それぞれの波長は、レンズの倍率色収差による加工用ガイド光の照射位置と測定用ガイド光の照射位置とのずれ量と、レンズの倍率色収差による加工光の照射位置と測定光の照射位置とのずれ量とが等しくなる波長に設定される。【選択図】図７