GOLD POWDER AND PRODUCTION METHOD OF THE GOLD POWDER AND GOLD PASTE

• Main Authors: KOGASHIWA TOSHINORI, MIYAIRI MASAYUKI
• Format: Patent
• Language: English; Japanese
• Published: 22.02.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASTING; CONDUCTORS; ELECTRICITY; INSULATORS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; PERFORMING OPERATIONS; POWDER METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TRANSPORTING; WORKING METALLIC POWDER

To provide metal powder of submicron order consisting of gold, which is excellent in adaptability to various working processes such as joining while optimizing an amount of chloride ion forming contamination, and a production method of the same.SOLUTION: The invention is related to gold powder which is composed of gold with purity of 99.9 mass% or more and which has an average particle diameter of 0.01-1.0 μm. The gold powder is characterized in that its chloride ion content is 100 ppm or less and its cyanide ion content is 10-1,000 ppm. The sum total of the chloride ion content and the cyanide ion content is preferably 110-1,000 ppm. Gold paste using the gold powder of the invention is suitably utilized for joining use such as die bonding of a semiconductor chip, for sealing use of a semiconductor package, and for various uses such as electrode and wiring formation.SELECTED DRAWING: None 【課題】金からなるサブミクロンオーダーの金属粉末であって、不純物となる塩化物イオン量を最適化しつつ、接合等の各種加工プロセスへの適応性に優れたもの及びその製造方法を提供する。【解決手段】本発明は、純度９９．９質量％以上の金からなり、平均粒径０．０１μｍ以上１．０μｍ以下の金粉末に関する。この金粉末は、塩化物イオンの含有量が１００ｐｐｍ以下であると共に、シアン化物イオンの含有量が１０ｐｐｍ以上１０００ｐｐｍ以下であることを特徴とする。塩化物イオンの含有量とシアン化物イオンの含有量との合計については、１１０ｐｐｍ以上１０００ｐｐｍ以下であることが好ましい。本発明に係る金粉末を利用した金ペーストは、半導体チップのダイボンディング等の接合用途や半導体パッケージの封止用途、電極・配線形成等の各種用途に好適に活用される。【選択図】なし