TERMINAL MATERIAL FOR CONNECTOR, AND CONNECTOR TERMINAL

• Main Authors: TARUTANI YOSHIE, KUBOTA KENJI
• Format: Patent
• Language: English; Japanese
• Published: 22.02.2021
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CURRENT COLLECTORS; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; LINE CONNECTORS; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

To provide a terminal material for a connector, capable of enhancing adhesion of a silver tin alloy-plating layer to improve abrasion resistance and heat resistance, and to provide a connector terminal.SOLUTION: A terminal material for a connector includes: a base material, at least a surface of which consists of copper or a copper alloy; a nickel plating layer formed on a surface of the base material; an intermediate plating layer formed on the nickel plating layer; and a silver tin alloy-plating layer formed on the intermediate plating layer, wherein the intermediate plating layer comprises 90 mass% or more of one of Cu, Pd, Co, and Mn, the film thickness of the intermediate plating layer is 0.02 μm or more, the silver tin alloy-plating layer contains Ag in a range of 70 at.% or more and 85 at.% or less and mainly comprises a silver tin-based intermetallic compound, and the film thickness of the silver tin-plating layer is 0.5 μm or more and 5 μm or less.SELECTED DRAWING: Figure 1 【課題】銀錫合金めっき層の密着性を高めて、耐摩耗性及び耐熱性を向上できるコネクタ用端子材及びコネクタ用端子を提供する。【解決手段】少なくとも表面が銅又は銅合金からなる基材と、該基材の表面に形成されたニッケルめっき層と、該ニッケルめっき層の上に形成された中間めっき層と、該中間めっき層の上に形成された銀錫合金めっき層とを備え、中間めっき層は、Ｃｕ，Ｐｄ，Ｃｏ，Ｍｎのいずれか一種を９０質量％以上含有し、中間めっき層の膜厚が０．０２μｍ以上であり、銀錫合金めっき層は、Ａｇを７０ａｔ％以上８５ａｔ％以下の範囲で含み、かつ、銀錫系金属間化合物を主成分としており、銀錫合金めっき層の膜厚は０．５μｍ以上５μｍ以下である。【選択図】 図１