HEAT PROCESSING DEVICE AND PROCESSING METHOD

• Main Author: SANO YOHEI
• Format: Patent
• Language: English; Japanese
• Published: 15.02.2021
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

To provide a technique for suppressing scattering of a sublimate from a coating film on a substrate.SOLUTION: A heat processing unit U8 as a heat processing apparatus for performing heat processing of a substrate W on which a resist film is formed and the resist film is subjected to exposure processing includes: a heating plate 21 that supports and heats a substrate; a chamber 41 that covers a processing space S on the heating plate; a gas ejecting part 50 that ejects processing gas from above toward the substrate on the heating plate within the chamber; a gas flow path 81 as a gas supply part that supplies gas into the chamber from below a surface of the substrate, within the chamber; and an exhaust mechanism 70 as an exhaust part that evacuates the chamber through exhaust holes 71 that are formed above the processing space and open downwards.SELECTED DRAWING: Figure 4 【課題】基板上の被膜からの昇華物の飛散を抑制する技術を提供する。【解決手段】レジストの被膜が形成され、被膜に露光処理が施された基板Ｗを熱処理する熱処理装置としての熱処理ユニットＵ８であって、基板を支持して加熱する熱板２１と、熱板上の処理空間Ｓを覆うチャンバ４１と、チャンバ内において、処理用ガスを熱板上の基板に向けて上方から吐出するガス吐出部５０と、チャンバ内において、基板の表面よりも下方からチャンバ内に気体を供給する気体供給部としての気体流路８１と、処理空間の上方に設けられた下方に開口する排気孔７１からチャンバ内を排気する排気部としての排気機構７０と、を有する。【選択図】図４