SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Author: NAKAI HITOSHI
• Format: Patent
• Language: English; Japanese
• Published: 15.02.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a substrate processing apparatus and a substrate processing method capable of reducing the oxygen concentration in the atmosphere near the upper surface of a substrate and suppressing the generation of particles on the upper surface of the substrate.SOLUTION: A central nozzle supplies inert gas toward the upper surface of a substrate W. A facing member elevating unit raises and lowers a facing member 6 together with an annular member 8 such that a blocking space SS is partitioned by the substrate W, the facing member 6, and the annular member 8. When the substrate W is rotated, the annular member 8 has a guide surface 85 that guides a processing liquid existing on the upper surface of the substrate W radially outward from the peripheral edge portion of the substrate W. A processing liquid discharge path 10 that discharges the processing liquid existing on the guide surface 85 to the outside of the blocking space SS is partitioned by an extension portion 66 and the annular member 8.SELECTED DRAWING: Figure 8 【課題】基板の上面付近の雰囲気中の酸素濃度を低減することができ、かつ、基板の上面におけるパーティクルの発生を抑制することができる基板処理装置および基板処理方法を提供する。【解決手段】中央ノズルが、基板Ｗの上面に向けて不活性ガスを供給する。対向部材昇降ユニットが、基板Ｗと、対向部材６と、環状部材８とによって遮断空間ＳＳが区画されるように環状部材８とともに対向部材６を昇降させる。基板Ｗが回転されることによって、環状部材８が、基板Ｗの上面に存在する処理液を基板Ｗの周縁部よりも径方向外方に案内する案内面８５を有する。延設部６６と環状部材８とによって、案内面８５に存在する処理液を遮断空間ＳＳ外へ排出する処理液排出路１０が区画されている。【選択図】図８