SYSTEMS AND METHODS FOR IMPROVED SEMICONDUCTOR ETCHING AND COMPONENT PROTECTION

• Main Authors: MARTIN YUE CHOI, TAN TIEN FAK, LOH LOK KEE, JUNG SOONWOOK, DMITRY LUBOMIRSKY, PARK SOO-NAM
• Format: Patent
• Language: English; Japanese
• Published: 24.12.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS; SEMICONDUCTOR DEVICES

To provide a semiconductor processing system improved in degradation characteristics of components of a processing chamber.SOLUTION: A processing system includes a processing chamber 205 having a gas box 220 defining an access to the processing chamber 205. The processing chamber includes a spacer 222 characterized by a first surface 321 with which the gas box is coupled, and the spacer defines a recessed ledge 323 on an interior portion of the first surface. The processing chamber includes a support bracket 305 seated on the recessed ledge that extends along a second surface 324 of the spacer. The processing chamber also includes a gas distribution plate 310 seated on the support bracket.SELECTED DRAWING: Figure 3 【課題】処理チャンバの部品の劣化特性を改善した半導体処理システムを提供する。【解決手段】処理システムにおいて、処理チャンバ２０５へのアクセス部を画定するガスボックス２２０を有する処理チャンバ２０５を含む。処理チャンバは、ガスボックスが結合される第１の表面３２１によって特徴付けられるスペーサ２２２を含む。スペーサは、第１の表面の内側部分に凹状棚部３２３を画定する。処理チャンバは、スペーサの第２の表面３２４に沿って延びる、凹状棚部に据え付けられた支持ブラケット３０５を含む。処理チャンバはまた、支持ブラケットに据え付けられたガス分配プレート３１０を含む。【選択図】図３