ELECTROMAGNETIC WAVE SHIELDING BODY AND METHOD FOR MANUFACTURING THE SAME

• Main Author: KURATA YUTO
• Format: Patent
• Language: English; Japanese
• Published: 08.10.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide an electromagnetic wave shielding body superior in electromagnetic wave shielding performance and small in variation thereof.SOLUTION: An electromagnetic wave shielding body 10 is formed from a resin composition containing a thermoplastic resin A, a thermoplastic resin B, and a conductive filler, wherein the content of the conductive filler is 3.0 mass% or more and 15.0 mass% or less. When a melting point of a crystal resin and a glass transition temperature of an amorphous resin are used as a reference temperature of processability, the thermoplastic resin A is higher than the thermoplastic resin B in processability reference temperature.SELECTED DRAWING: Figure 1 【課題】電磁波遮蔽性能が優れ、しかも、そのバラツキが小さい電磁波遮蔽体を提供する。【解決手段】電磁波遮蔽体１０は、熱可塑性樹脂Ａと、熱可塑性樹脂Ｂと、導電性フィラーとを含有し、前記導電性フィラーの含有量が３．０質量％以上１５．０質量％以下である樹脂組成物で形成されている。結晶性樹脂の融点及び非結晶性樹脂のガラス転移温度を加工性基準温度として、前記熱可塑性樹脂Ａの加工性基準温度が、前記熱可塑性樹脂Ｂの加工性基準温度よりも高い。【選択図】図１