TREATMENT SOLUTION AND TREATMENT METHOD

• Main Authors: IWAMOTO TAKEAKI, UCHIDA KENYA, KWON EUNSANG, FUKUI HIROYUKI, UEMATSU IKUO
• Format: Patent
• Language: English; Japanese
• Published: 10.09.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To provide a treatment solution and a treatment method, capable of treating by-products produced by the method of depositing a silicon-containing material on a substrate in a highly secure manner, by using gas containing silicon and halogen.SOLUTION: According to an embodiment, there is provided a treatment solution. The treatment solution is a treatment solution for treating halosilanes having a ring structure. The treatment solution contains at least one of inorganic bases and organic bases, and is basic.SELECTED DRAWING: None 【課題】ケイ素及びハロゲンを含むガスを用いて、基材上にケイ素含有物を堆積させる方法により生じる副生成物を安全性の高い方法で処理できる処理液及び処理方法を提供する。【解決手段】一実施形態によると、処理液が提供される。処理液は、環状構造を有するハロシラン類を処理するための処理液である。処理液は、無機塩基及び有機塩基の少なくとも一方を含み、塩基性である。【選択図】 なし