SEMICONDUCTOR CHIP

To improve reliability of a semiconductor device.SOLUTION: A semiconductor device is characterized in that sloped portions SLP are formed on connection parts between a pad PD and a lead-out wiring portion DWU. This can suppress crack formation in a coating area where a part of the pad PD is covered...

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Bibliographic Details
Main Authors TOMITA KAZURO, TAKEWAKA HIROKI
Format Patent
LanguageEnglish
Japanese
Published 25.06.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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