SILICON CARBIDE SEMICONDUCTOR DEVICE AND POWER CONVERTER
To solve the problem that in an SiC-MOSFET with a built-in Schottky diode, there is a case where bipolar current is passed through a second well region formed at a terminal part to reduce breakdown voltage.SOLUTION: In an SiC-MOSFET with a built-in Schottky diode, a conductive layer in Schottky conn...
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Main Authors | , , , , |
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Format | Patent |
Language | English Japanese |
Published |
18.06.2020
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Subjects | |
Online Access | Get full text |
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Summary: | To solve the problem that in an SiC-MOSFET with a built-in Schottky diode, there is a case where bipolar current is passed through a second well region formed at a terminal part to reduce breakdown voltage.SOLUTION: In an SiC-MOSFET with a built-in Schottky diode, a conductive layer in Schottky connection with a second well region is provided on the second well region formed in a terminal part, and the conductive layer is electrically connected with a source electrode of the MOSFET. A conductive layer contact hole is provided for connecting only the conductive layer and the source electrode.SELECTED DRAWING: Figure 2
【課題】ショットキダイオードを内蔵するSiC−MOSFETにおいて、終端部に形成される第2ウェル領域がバイポーラ通電して耐圧が低下する場合があった。【解決手段】ショットキダイオードを内蔵するSiC−MOSFETにおいて、終端部に形成される第2ウェル領域上に第2ウェル領域とショットキ接続する導電性層を設け、導電性層をMOSFETのソース電極と電気的に接続させる。導電性層とソース電極とだけを接続させる導電性層コンタクトホールを設ける。【選択図】図2 |
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Bibliography: | Application Number: JP20200046320 |