PEELING LIQUID, PEELING METHOD, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT

• Main Authors: MURAKAMI YUKAKO, UEMATSU IKUO
• Format: Patent
• Language: English; Japanese
• Published: 07.05.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; USE OF MATERIALS AS ADHESIVES; USE OF MATERIALS THEREFOR; WOODSTAINS

To provide a peeling liquid which enables easy peeling of a support plate from a laminate comprising a substrate, a support plate, and an adhesive; and a peeling method and a manufacturing method of an electronic component using the peeling liquid.SOLUTION: Provided is a peeling liquid. The peeling liquid is one for peeling a support plate from a laminate. The peeling liquid contains a first solvent and a second solvent. Polarity of the second solvent is higher than that of the first solvent. The laminate comprises a substrate, a support plate, and an adhesive. The adhesive is positioned between the substrate and the support plate. The adhesive contains a compound having a first functional group and a second functional group which are mutually different.SELECTED DRAWING: Figure 5 【課題】基板と支持板と接着剤とを含む積層体から支持板を容易に剥離可能な剥離液、並びに、この剥離液を用いた剥離方法及び電子部品の製造方法を提供する。【解決手段】実施形態によると、剥離液が提供される。剥離液は、積層体から支持板を剥離するための剥離液である。剥離液は、第１溶媒と第２溶媒とを含む。第２溶媒の極性は、第１溶媒の極性よりも高い。積層体は、基板と支持板と接着剤とを含む。接着剤は、基板及び支持板の間に位置する。接着剤は、互いに異なる第１官能基及び第２官能基を有する化合物を含む。【選択図】 図５