PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

• Main Author: IGAWA YUJI
• Format: Patent
• Language: English; Japanese
• Published: 02.04.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a printed wiring board with high pad connection reliability.SOLUTION: A printed wiring board 10 includes: a resin insulating layer 30; a conductor circuit 34 formed on the resin insulating layer; an outermost resin layer 50 provided on the resin insulating layer 30 and the conductor circu...