PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

• Main Author: IGAWA YUJI
• Format: Patent
• Language: English; Japanese
• Published: 02.04.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a printed wiring board with high pad connection reliability.SOLUTION: A printed wiring board 10 includes: a resin insulating layer 30; a conductor circuit 34 formed on the resin insulating layer; an outermost resin layer 50 provided on the resin insulating layer 30 and the conductor circuit; a metal post 60, formed on the conductive circuit, having a tip exposed from the outermost resin layer 50; and a dam 56, formed as a part of the outermost resin layer 50, surrounding a part or all of a mounting pad group constituted by the metal post 60.SELECTED DRAWING: Figure 1 【課題】パッドの接続信頼性の高いプリント配線板の提供する。【解決手段】プリント配線板１０は、樹脂絶縁層３０と樹脂絶縁層上に形成された導体回路３４と、樹脂絶縁層３０及び導体回路上に設けられた最表層の樹脂層５０と、導体回路上に形成され、先端が最表層の樹脂層５０から露出する金属ポスト６０と、最表層の樹脂層５０の一部として形成され、金属ポスト６０により構成される実装用のパッド群の一部、或いは、全部を囲むダム５６と、を有する。【選択図】図１