IMAGE FORMING APPARATUS AND SUBSTRATE
To suppress the size of a wiring area as compared with a case in which a power supply voltage is applied to a semiconductor integrated circuit having a plurality of elements having different magnitudes of transient current fluctuations through a rectangular terminal when a power supply voltage is ap...
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Format | Patent |
Language | English Japanese |
Published |
02.04.2020
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Abstract | To suppress the size of a wiring area as compared with a case in which a power supply voltage is applied to a semiconductor integrated circuit having a plurality of elements having different magnitudes of transient current fluctuations through a rectangular terminal when a power supply voltage is applied to the semiconductor integrated circuit.SOLUTION: An image forming apparatus includes a substrate on which a semiconductor integrated circuit having a plurality of elements having different magnitudes of transient current fluctuations is mounted, a ground terminal grounded on the back surface of a region where the semiconductor integrated circuit is mounted on the substrate, a large fluctuation terminal that is provided along the outer periphery of the ground terminal and applies a voltage to an element having a large transient current fluctuation from among the plurality of elements, and a small fluctuation terminal that is provided along the large fluctuation terminal on the opposite side to the ground terminal across the large fluctuation terminal and applies a voltage to an element having a small transient current fluctuation from among the plurality of elements.SELECTED DRAWING: Figure 6
【課題】過渡的な電流変動の大きさが異なる素子を複数有する半導体集積回路に電源電圧を印加する際、長方形状の端子を介してこの半導体集積回路に電源電圧を印加する場合と比較して、配線面積を抑制する。【解決手段】過渡的な電流変動の大きさが異なる複数の素子を有する半導体集積回路を搭載する基板と、基板における半導体集積回路が搭載されている領域の裏面に接地して設けられる接地端子と、接地端子の外周に沿って設けられ、複数の素子のうち過渡的な電流変動が大きい素子に電圧を印加する大変動端子と、大変動端子を挟んで接地端子とは反対側において大変動端子に沿って設けられ、複数の素子のうち過渡的な電流変動が小さい素子に電圧を印加する小変動端子とを備える画像形成装置。【選択図】図6 |
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AbstractList | To suppress the size of a wiring area as compared with a case in which a power supply voltage is applied to a semiconductor integrated circuit having a plurality of elements having different magnitudes of transient current fluctuations through a rectangular terminal when a power supply voltage is applied to the semiconductor integrated circuit.SOLUTION: An image forming apparatus includes a substrate on which a semiconductor integrated circuit having a plurality of elements having different magnitudes of transient current fluctuations is mounted, a ground terminal grounded on the back surface of a region where the semiconductor integrated circuit is mounted on the substrate, a large fluctuation terminal that is provided along the outer periphery of the ground terminal and applies a voltage to an element having a large transient current fluctuation from among the plurality of elements, and a small fluctuation terminal that is provided along the large fluctuation terminal on the opposite side to the ground terminal across the large fluctuation terminal and applies a voltage to an element having a small transient current fluctuation from among the plurality of elements.SELECTED DRAWING: Figure 6
【課題】過渡的な電流変動の大きさが異なる素子を複数有する半導体集積回路に電源電圧を印加する際、長方形状の端子を介してこの半導体集積回路に電源電圧を印加する場合と比較して、配線面積を抑制する。【解決手段】過渡的な電流変動の大きさが異なる複数の素子を有する半導体集積回路を搭載する基板と、基板における半導体集積回路が搭載されている領域の裏面に接地して設けられる接地端子と、接地端子の外周に沿って設けられ、複数の素子のうち過渡的な電流変動が大きい素子に電圧を印加する大変動端子と、大変動端子を挟んで接地端子とは反対側において大変動端子に沿って設けられ、複数の素子のうち過渡的な電流変動が小さい素子に電圧を印加する小変動端子とを備える画像形成装置。【選択図】図6 |
Author | KAWASHIMA SHIMPEI |
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DocumentTitleAlternate | 画像形成装置および基板 |
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RelatedCompanies | FUJI XEROX CO LTD |
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Snippet | To suppress the size of a wiring area as compared with a case in which a power supply voltage is applied to a semiconductor integrated circuit having a... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES STAMPS TRANSPORTING TYPEWRITERS |
Title | IMAGE FORMING APPARATUS AND SUBSTRATE |
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