SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Authors: MORI NOBUHIKO, OBARA TAKANORI
• Format: Patent
• Language: English; Japanese
• Published: 20.02.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CLEANING; CLEANING IN GENERAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a technique capable of suppressing an adhesion of a particle onto a lower surface of a substrate.SOLUTION: A substrate processing apparatus comprises a rotational plate, a plurality of fixing support parts, a plurality of movable support parts, and a plurality of lift pins. The rotational plate can be rotated. The plurality of fixing support parts is immovably provided onto the rotational plate, and exists in an arc shape along a peripheral direction of the rotational plate to support a substrate. The plurality of movable support parts is provided onto the rotational plate so as to enable contact with and separation from the rotational plate to support the substrate. The plurality of lift pins pushes up the plurality of movable support parts to an upper direction.SELECTED DRAWING: Figure 5 【課題】基板の下面へのパーティクルの付着を抑制することができる技術を提供する。【解決手段】本開示による基板処理装置は、回転プレートと、複数の固定支持部と、複数の可動支持部と、複数のリフトピンとを備える。回転プレートは、回転可能である。複数の固定支持部は、回転プレート上に固定的に設けられ、回転プレートの周方向に沿って円弧状に延在し、基板を支持する。複数の可動支持部は、回転プレート上に回転プレートに対して接離可能に設けられ、基板を支持する。複数のリフトピンは、複数の可動支持部を上方へ押し上げる。【選択図】図５