LOW-LOSS INSULATING RESIN COMPOSITION AND INSULATING FILM USING THE SAME

• Main Authors: SHIM JI HYE, JUNG HYUNG-MI, KIM KI-SEOK, WOO JI-EUN
• Format: Patent
• Language: English; Japanese
• Published: 14.11.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INSULATORS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a low-loss insulating resin composition and an insulating film using the same.SOLUTION: The low-loss insulating resin composition contains: (a) a composite epoxy-based resin containing a cyanate ester resin, a biphenylaralkyl novolac type epoxy resin, and a fluorine-containing epoxy resin; (b) an active ester curing agent; (c) a thermoplastic resin; (d) a curing accelerator; (e) a filler; and (f) a thickener.SELECTED DRAWING: Figure 1 【課題】本発明は、低損失絶縁樹脂組成物及びこれを用いた絶縁フィルムを提供する。【解決手段】低損失絶縁樹脂組成物は、（ａ）シアネートエステル樹脂、ビフェニルアラルキルノボラック型エポキシ樹脂、及びフッ素含有エポキシ樹脂を含む複合エポキシ系樹脂と、（ｂ）活性エステル硬化剤と、（ｃ）熱可塑性樹脂と、（ｄ）硬化促進剤と、（ｅ）充填剤と、（ｆ）増粘剤と、を含む。【選択図】図１