SEMICONDUCTOR DEVICE
To provide a semiconductor device having a super junction structure.SOLUTION: A semiconductor device having a super junction structure composed of first conductivity type columns and second conductivity type columns comprises: a first region of the super junction structure in which a PN ratio increa...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
31.10.2019
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a semiconductor device having a super junction structure.SOLUTION: A semiconductor device having a super junction structure composed of first conductivity type columns and second conductivity type columns comprises: a first region of the super junction structure in which a PN ratio increases with the increasing distance from a first surface side toward a second surface side of the super junction structure; and a second region of the super junction structure which contacts the first region and adjacent to a channel region of the semiconductor device. A PN ratio in the second region is lower than a PN ratio of the first region on and end on the second surface side and a thickness of the second region is thinner than a thickness of the first region.SELECTED DRAWING: Figure 1
【課題】スーパージャンクション構造を有する半導体装置を提供する。【解決手段】第1導電型カラムと第2導電型カラムで構成されたスーパージャンクション構造を有する半導体装置において、スーパージャンクション構造の第1面側から第2面側に向けてPN比が増加するスーパージャンクション構造の第1領域と、第1領域と接し、且つ、半導体装置のチャネル領域に隣接するスーパージャンクション構造の第2領域とを備え、第2領域におけるPN比が、第1領域の第2面側の端部におけるPN比よりも小さく、且つ、第2領域の厚さは、第1領域の厚さよりも薄い半導体装置を提供する。【選択図】図1 |
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Bibliography: | Application Number: JP20190124100 |