HYBRID LASER PROCESSING DEVICE

• Main Author: OTSUKA YOSHIO
• Format: Patent
• Language: English; Japanese
• Published: 24.10.2019
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a hybrid laser processing device that can prevent water from being splashed and being atomized to process a work-piece accurately.SOLUTION: A hybrid laser processing device 10 comprises a holding base 12 for holding a work-piece 14, and a processing head 16 for jetting a liquid beam toward a work-piece 14 held on the holding base 12 and irradiating the work-piece with a laser beam introduced into the liquid beam. The holding base 12 has a cylindrical stand main body 24 with a bottom whose upper surface is opened, and a pedestal part 26 with elasticity, stored in an opening recessed part 30a of the base main body 24, made of synthetic resin and formed in a continuous pore-sponge shape, on an upper surface of which the work-piece 14 to be processed is held.SELECTED DRAWING: Figure 1 【課題】液体の跳ね上げ、霧化を防止し、精度よくワークの加工が行えるハイブリッドレーザー加工装置を提供することにある。【解決手段】ワーク１４を保持する保持台１２と、保持台１２上に保持されたワーク１４に向けて、液体ビームを噴射すると共に前記液体ビーム内に導入されたレーザービームを照射する加工ヘッド１６を有するハイブリッドレーザー加工装置１０において、保持台１２は、上面側が開口された有底筒状の台本体２４と、台本体２４の開口凹部３０ａ内に収容され、上面に加工すべきワーク１４が保持される、合成樹脂製であって、弾性を有し連続気孔のスポンジ状をなす台座部２６とを有することを特徴とする。【選択図】図１