ELECTRONIC CIRCUIT MODULE

• Main Author: KAWAMURA AYAKO
• Format: Patent
• Language: English; Japanese
• Published: 26.09.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide an electronic circuit module which is easily processed and has high heat radiation performance and shielding performance.SOLUTION: An electronic circuit module according to one embodiment includes: a circuit board in which an electronic component is mounted on an upper surface; and a cover which is attached to the circuit board so as to cover the electronic component. The cover has: a top plate part facing the upper surface of the circuit board; a side plate part extending downward from at least a part of an outer periphery of the top plate part; and a heat transfer part which extends from at least a part of a lower end of the side plate part and contacts with the electronic component.SELECTED DRAWING: Figure 2 【課題】 加工が簡単で放熱性及びシールド性が高い電子回路モジュールを提供する。【解決手段】 一実施形態に係る電子回路モジュールは、上面に電子部品を実装された回路基板と、前記電子部品を覆うように前記回路基板に取り付けられたカバーと、を備えた電子回路モジュールであって、前記カバーは、前記回路基板の上面と対向する天板部と、前記天板部の外周の少なくとも一部から下方に延びる側板部と、前記側板部の下端の少なくとも一部から延び、前記電子部品と接触する伝熱部と、を有する。【選択図】 図２