STYRENIC RESIN COMPOSITION AND MOLDING

• Main Authors: CHIKADA YASUSHI, TOZAWA HITOSHI, SUWA TOSHIHIRO
• Format: Patent
• Language: English; Japanese
• Published: 22.08.2019
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a styrenic resin composition that offers a good balance between antistatic performance and impact properties, and a molding thereof.SOLUTION: The present invention provides a styrenic resin composition containing (A) a styrenic resin, and (B) a polyether polymer that has a constitutional unit derived from an oxirane monomer having 4 or more carbon atoms, with a constitutional unit derived from an oxirane monomer having an unsaturated bond being less than 1.0 mol%, and a molding thereof.SELECTED DRAWING: None 【課題】帯電防止性能と、衝撃特性のバランスに優れたスチレン系樹脂組成物、及びその成形体の提供。【解決手段】（Ａ）スチレン系樹脂、（Ｂ）炭素数４以上で構成されるオキシラン単量体由来の構成単位を有し、不飽和結合を有するオキシラン単量体由来の構成単位が１．０モル％未満であるポリエーテル系重合体を含有するスチレン系樹脂組成物、及びその成形体。【選択図】なし