DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

• Main Author: ANDO NAOHISA
• Format: Patent
• Language: English; Japanese
• Published: 25.07.2019
• Subjects: ADVERTISING; BASIC ELECTRIC ELEMENTS; CRYPTOGRAPHY; DISPLAY; DISPLAYING; EDUCATION; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LABELS OR NAME-PLATES; PHYSICS; SEALS; SEMICONDUCTOR DEVICES; SIGNS

To provide a method for manufacturing a display device, by which degradation in position detection accuracy is prevented even when an alignment mark is partially invisible.SOLUTION: A method for manufacturing a display device is provided for forming a plurality of display devices 100 each including a display region, a peripheral region 140 and a boundary region 130 on a first substrate for multi-face patterning. The method includes: forming an identifier 200 on the first substrate for multi-face patterning, the identifier including a first identifying part 210 disposed in the boundary region located at a boundary of the display device and a second identifying part 220 disposed in the peripheral region located between the display region and the boundary region; aligning a laser and the first substrate for multi-face patterning by using the first identifying part; cutting a second substrate for multi-face patterning in the boundary region; aligning a laser and the first substrate for multi-face patterning by using the second identifying part; and cutting the first substrate for multi-face patterning in the boundary region. The step of cutting the second substrate for multi-face patterning includes carbonizing at least a part of the first substrate for multi-face patterning.SELECTED DRAWING: Figure 5 【課題】アライメントマークの一部が視認できなくなっても位置検出精度の低下を防止する表示装置の製造方法を提供する。【解決手段】多面取り用第１基板の上に、表示領域と周辺領域１４０と境界領域１３０とを含む複数の表示装置１００を形成する表示装置の製造方法において、表示装置の境界に位置する境界領域に配置される第１識別部２１０と、表示領域と境界領域の間に位置する周辺領域に配置される第２識別部２２０と、を含む識別子２００を多面取り用第1基板の上に形成し、第１識別部を用いてレーザーと多面取り用第１基板の位置を合わせ、境界領域で多面取り用第２基板を切断し、第２識別部を用いてレーザーと多面取り用第１基板の位置を合わせ、境界領域で多面取り用第１基板を切断すること、を含み、多面取り用第２基板を切断することは、多面取り用第１基板の少なくとも一部を炭化する。【選択図】図５