RESIN COMPOSITION AND APPLICATIONS THEREOF

• Main Authors: TANAKA SHINYA, OKU TATSUYA, EGAWA MAKOTO, NODA KIMINORI, SHIOZAKI NANAO
• Format: Patent
• Language: English; Japanese
• Published: 25.07.2019
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

To provide a sealant film and a laminate film that can exhibit easy peelability equal to or superior to the prior art even though the ratio of a polybutene resin to a polyethylene resin is low and to provide a material therefor.SOLUTION: A resin composition contains 5 to 30 mass% of (A) a 1-butene-based polymer satisfying (a-1), (a-2) and (a-3) as given below and 95 to 70 mass% of (B) an ethylene-based polymer. (a-1): a ratio of the component having a molecular weight of 10,000 or less as determined from an integral molecular weight distribution curve obtained by measurement by GPC method is 2% or more; (a-2): a melting point as measured by a differential scanning calorimeter is 100 to 130°C; and (a-3): a melt flow rate (190°C and a load of 2.16 kg) is 0.3 to 10 g/10 min.SELECTED DRAWING: None 【課題】ポリエチレン樹脂に対するポリブテン樹脂の割合が少なくても従来技術と同等以上の易剥離性を発現することのできるシーラントフィルムおよび積層フィルム、ならびにその材料等を提供すること。【解決手段】以下の（ａ−１）、（ａ−２）および（ａ−３）を満たす１−ブテン系重合体（Ａ）を５〜３０質量％、ならびにエチレン系重合体（Ｂ）を９５〜７０質量％含有する樹脂組成物。（ａ−１）：ＧＰＣ法による測定によって得られた積分分子量分布曲線から求められる分子量が１０，０００以下の成分割合が、２％以上である。（ａ−２）：示差走査熱量計により測定される融点が１００〜１３０℃である。（ａ−３）：メルトフローレート（１９０℃、２．１６ｋｇ荷重）が０．３〜１０ｇ／１０分である。【選択図】なし