SEMICONDUCTOR DEVICE

To provide a semiconductor light emitting device which can achieve downsizing properly.SOLUTION: A semiconductor light emitting device includes: a first lead frame having a bonding part; a second lead frame which is separated from the first lead frame in a first direction; a semiconductor light-emit...

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Bibliographic Details
Main Author KOBAYAKAWA MASAHIKO
Format Patent
LanguageEnglish
Japanese
Published 27.06.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a semiconductor light emitting device which can achieve downsizing properly.SOLUTION: A semiconductor light emitting device includes: a first lead frame having a bonding part; a second lead frame which is separated from the first lead frame in a first direction; a semiconductor light-emitting element electrically connected to the first lead frame and the second lead frame; and a cover which covers a part of the first lead frame and a part of the second lead frame while exposing a rear surface of the first lead frame and a rear surface of the second lead frame in a flush form. The first lead frame further includes a thick extension part extending from the bonding part in a direction orthogonal to the first direction.SELECTED DRAWING: Figure 1 【課題】適正に小型化を図ることが可能な半導体発光装置を提供する。【解決手段】 ボンディング部を有する第１リードフレームと、上記第１リードフレームとは第１方向に分離された第２リードフレームと、上記第１リードフレームと上記第２リードフレームとに電気的に接続された半導体発光素子と、上記第１リードフレームの裏面および上記第２リードフレームの裏面を面一状に露出させつつ上記第１リードフレームの一部および上記第２リードフレームの一部を覆うケースと、を備え、上記第１リードフレームは、上記ボンディング部から上記第１方向と直交する方向に延びる厚肉延出部をさらに備える。【選択図】 図１
Bibliography:Application Number: JP20190071172