POSITION DETECTION DEVICE, SEMICONDUCTOR CHIP ADHESION DEVICE, SEMICONDUCTOR PACKAGING DEVICE, AND POSITION DETECTION METHOD

• Main Authors: MOROISHI FUMITAKA, KAJINAMI MASAHITO, YOSHIDA SOTETSU
• Format: Patent
• Language: English; Japanese
• Published: 27.06.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To detect the change of a parallel state of a bonding tool adjusted by a copying mechanism.SOLUTION: A position detection device comprises: a first position detection part mounted to a semiconductor chip adhesion device having a pressing adhesion mechanism of a semiconductor chip, and a copying mech...