POSITION DETECTION DEVICE, SEMICONDUCTOR CHIP ADHESION DEVICE, SEMICONDUCTOR PACKAGING DEVICE, AND POSITION DETECTION METHOD

• Main Authors: MOROISHI FUMITAKA, KAJINAMI MASAHITO, YOSHIDA SOTETSU
• Format: Patent
• Language: English; Japanese
• Published: 27.06.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To detect the change of a parallel state of a bonding tool adjusted by a copying mechanism.SOLUTION: A position detection device comprises: a first position detection part mounted to a semiconductor chip adhesion device having a pressing adhesion mechanism of a semiconductor chip, and a copying mechanism that includes a fixing part and a rotation part each having a convex part or a concave part in a partial spherical shape opposite, and adjusts an inclination of the pressing adhesion mechanism; and a second position detection part mounted onto the semiconductor chip adhesion device, and detecting a second rotation position of the rotation position at a first detection position of detecting the first rotation position by the first position detection part, and a second detection position different from the first detection position.SELECTED DRAWING: Figure 1 【課題】倣い機構で調整したボンディングツールの平行状態の変化を検知する。【解決手段】本発明の一態様は、半導体チップの押圧接着機構と、互いに対向する部分球面形状の凸部または凹部を有する固定部と回動部を有して前記押圧接着機構の傾きを調整する倣い機構とを備える半導体チップ接着装置に搭載され、前記回動部の第１回動位置を検知する第１位置検知部と、前記半導体チップ接着装置に搭載され、前記第１位置検知部が前記第１回動位置を検知する第１検知位置と異なる第２検知位置で、前記回動部の第２回動位置を検知する第２位置検知部とを備える位置検知装置である。【選択図】図１