TRANSFER CONTAINER AUTO CLAMP MECHANISM

To provide an inexpensive auto clamp mechanism capable of automatically fixing/releasing a wafer transfer container to/from a manufacturing installation, and having a small height dimension.SOLUTION: A wafer transfer container 200 is mounted on a container mounting table 130. While being mounted on...

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Bibliographic Details
Main Authors HARA SHIRO, SAGISAWA KOJI, MAEKAWA HITOSHI, NISHIHARA HIROYUKI
Format Patent
LanguageEnglish
Japanese
Published 24.06.2019
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Summary:To provide an inexpensive auto clamp mechanism capable of automatically fixing/releasing a wafer transfer container to/from a manufacturing installation, and having a small height dimension.SOLUTION: A wafer transfer container 200 is mounted on a container mounting table 130. While being mounted on the container bottom 201 of the wafer transfer container 200, a semiconductor wafer 300 is carried into the manufacturing apparatus body from a wafer carry-in port 131. An auto clamp mechanism 140 abuts the claws 702 of multiple clamp claws 141 against a gradient abutment surface 202a provided on the container lid part 202 of the wafer transfer container 200 and presses substantially in the horizontal direction, and makes the wafer transfer container 200 generate a pressed force component in the vertical direction, and fixes to the container mounting table 130.SELECTED DRAWING: Figure 6 【課題】ウェハ搬送容器を製造装置に自動的に固定・解除することができ、高さ寸法が小さいオートクランプ機構を安価に提供する。【解決手段】容器載置台130には、ウェハ搬送容器200が載置される。このウェハ搬送容器200の容器底部201に載置したままの状態で、半導体ウェハ300が、ウェハ搬入口131から製造装置本体へ搬入される。オートクランプ機構140は、複数のクランプ爪141の爪部702を、ウェハ搬送容器200の容器蓋部202に設けた傾斜当接面202aに当接して略水平方向へ押圧することで、このウェハ搬送容器200に垂直方向の被押圧力成分を発生させて、容器載置台130に固定する。【選択図】図6
Bibliography:Application Number: JP20170230318