SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

• Main Authors: KAWAMURA NORIFUMI, OSADA MASAKAZU
• Format: Patent
• Language: English; Japanese
• Published: 06.06.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a silicone-modified epoxy resin composition excellent in tracking resistance and a semiconductor device sealed with the resin composition.SOLUTION: The silicone-modified epoxy resin composition contains as essential components: (A) a silicone-modified epoxy resin having at least two epoxy groups, which is obtained by a hydrosilylation reaction between an alkenyl group-containing epoxy compound and an organopolysiloxane represented by a specific formula; (B) a silicone-modified phenolic resin having at least two phenolic hydroxyl groups, which is obtained by a hydrosilylation reaction between an alkenyl group-containing phenolic compound represented by a specific formula and an organopolysiloxane represented by the specific formula; (C) a black pigment; and (D) an inorganic filler (excluding the black pigment (C)).SELECTED DRAWING: None 【課題】 耐トラッキング性に優れたシリコーン変性エポキシ樹脂組成物及び該樹脂組成物により封止された半導体装置を提供する。【解決手段】（Ａ）アルケニル基含有エポキシ化合物と特定式で表されるオルガノポリシロキサンとのヒドロシリル化反応により得られる、少なくとも２個のエポキシ基を有するシリコーン変性エポキシ樹脂、（Ｂ）特定式で示されるアルケニル基含有フェノール化合物と上記特定式で表されるオルガノポリシロキサンとのヒドロシリル化反応により得られる、少なくとも２個のフェノール性水酸基を有するシリコーン変性フェノール樹脂、（Ｃ）黒色顔料、及び（Ｄ）無機充填材（但し、（Ｃ）黒色顔料は除く）を必須成分として含むことを特徴とするシリコーン変性エポキシ樹脂組成物。【選択図】 なし