SEMICONDUCTOR LIGHT RECEIVING COMPONENT
To provide a semiconductor light receiving component capable of improving the high frequency property of a receiver device while maintaining the quality of the waveform output from a transimpedance amplifier (TIA) when operating in connection to the TIA.SOLUTION: The semiconductor light receiving co...
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Main Authors | , , , , |
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Format | Patent |
Language | English Japanese |
Published |
25.04.2019
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a semiconductor light receiving component capable of improving the high frequency property of a receiver device while maintaining the quality of the waveform output from a transimpedance amplifier (TIA) when operating in connection to the TIA.SOLUTION: The semiconductor light receiving component comprises: a photodiode 101; a signal extraction pad 103 to which a wiring for taking out an output signal from the photodiode 101 and inputting the same to an external element is connected; and a resistive element 102 one end of which is connected to the anode of the photodiode 101 and the other end of which is connected to the signal extraction pad 103, which are monolithically integrated on the same semiconductor substrate.SELECTED DRAWING: Figure 1
【課題】TIAと接続されて動作するときに、TIA出力波形の品質を維持したままレシーバ装置の高周波特性を向上させることができる半導体受光部品を提供すること。【解決手段】フォトダイオード101と、前記フォトダイオード101の出力信号を取り出して外部素子に入力する配線が接続される信号取り出し用パッド103と、一端が前記フォトダイオード101のアノードと接続され、他端が前記信号取り出し用パッド103に接続された抵抗体102とが同一の半導体基板上にモノリシック集積されていることを特徴とする半導体受光部品である。【選択図】図1 |
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Bibliography: | Application Number: JP20170194578 |