POLYIMIDE FILM, METAL-CLAD LAMINATE, AND CIRCUIT BOARD

• Main Author: ANDO TOMONORI
• Format: Patent
• Language: English; Japanese
• Published: 25.04.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

To provide a polyimide film capable of reducing dimensional change during high temperature processing while it is excellent in adhesiveness with a metal layer with having a thermoplastic polyimide layer.SOLUTION: There is provided a polyimide film having a non-thermoplastic polyimide layer and a thermoplastic polyimide layer, in which (i) the non-thermoplastic polyimide has a rigid diamine residue of 75 to 95 pts.mol. and a flexure diamine residue of 5 to 25 pts.mol. based on total 100 pts.mol. of the rigid diamine residue and the flexure diamine residue; (ii) a diamine residue derived from (A1) is 40 to 90 pts.mol. and a paraphenylene diamine residue is 5 to 55 pts.mol. based on 100 pts.mol. of the rigid diamine residue; (iii) the flexure diamine residue is contained; and (iv) the thermoplastic polyimide contains a diamine residue of 40 pts.mol. or more based on 100 pts.mol. of all diamine residues.SELECTED DRAWING: None 【課題】熱可塑性ポリイミド層を有して金属層との接着性に優れながら、高温加工時での寸法変化を低減させることができるポリイミドフィルムを提供する。【解決手段】非熱可塑性ポリイミド層と熱可塑性ポリイミド層を有し、i)非熱可塑性ポリイミドは剛直ジアミン残基及び屈曲ジアミン残基の合計１００モル部に対して、剛直ジアミン残基が７５〜９５モル部、屈曲ジアミン残基が５〜２５モル部；（ii）剛直ジアミン残基の１００モル部に対して、（Ａ１）から誘導されるジアミン残基が４０〜９０モル部、パラフェニレンジアミン残基が５〜５５モル部；（iii）屈曲ジアミン残基を含み；（iv）熱可塑性ポリイミドは、全ジアミン残基の１００モル部に対して、ジアミン残基を４０モル部以上含有するポリイミドフィルム【選択図】なし