SEMICONDUCTOR DEVICE MANUFACTURING METHOD

• Main Authors: SUZUKI NAOYA, TAKEKOSHI MASAAKI, TAKANO MARE
• Format: Patent
• Language: English; Japanese
• Published: 28.02.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a semiconductor device manufacturing method on which a semiconductor device manufacturing process can be simplified.SOLUTION: A semiconductor element 6 is mounted on a resin layer 1 of a film 3, in which the resin layer 1 is integrated with a substrate 2 peelable with respect to the resin layer 1, so that a bump surface points upward. Therefore, subsequently, the semiconductor element 6 is sealed, the surface of the element is ground, a rewiring layer is formed and the like, and the resin layer 1 is peeled off from the substrate 2 and then fragmented, which can manufacture a fan-out wafer level package having a rear surface of the semiconductor element 6 protected in advance.SELECTED DRAWING: Figure 1 【課題】半導体装置製造プロセスの簡略化を可能とする半導体装置の製造方法を提供することを目的とする。【解決手段】樹脂層１と樹脂層１に対して剥離可能な基材２とが一体となったフィルム３の樹脂層１に、バンプ面が上となるように半導体素子６を搭載する。このため、その後、半導体素子６を封止し、その表面を研削し、再配線層の形成等を行い、基材２から樹脂層１を剥離した後に個片化することで、予め半導体素子６の裏面が保護されたファンアウトのウエハレベルパッケージが製造可能となる。【選択図】図１