SURFACE TREATMENT SILVER-COATED ALLOY POWDER, PRODUCTION METHOD OF POWDER, CONDUCTIVE PASTE, ELECTRONIC COMPONENT AND ELECTRIC DEVICE

• Main Authors: INOUE KENICHI, IIDA YUSUKE, YOSHIDA MASAHIRO, YAMADA TAKEHIRO, EBARA ATSUSHI, MASUDA KYOZO, DOMYO YOSHIYUKI
• Format: Patent
• Language: English; Japanese
• Published: 28.02.2019
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CABLES; CASTING; CHEMISTRY; CONDUCTORS; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; INSULATORS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; METALLURGY; PERFORMING OPERATIONS; POWDER METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WORKING METALLIC POWDER

To provide a material (metal powder) of a conductive paste capable of forming a conductive film furthermore excellent in solder wettability than a conductive paste containing silver-coated copper-nickel-zinc alloy powder which is well-known hitherto.SOLUTION: There is provided surface treatment silver-coated alloy powder comprising alloy particles, a silver-coated layer for coating the alloy particles, and a surface treatment layer for coating silver-coated alloy particles constituted of the alloy particles and the silver-coated layer. In the surface treatment silver-coated alloy powder, the alloy particle comprises copper, nickel, zinc and inevitable impurities, and a solder shrinkage degree is 6% or higher, when performing a solder wettability test to the surface treatment silver-coated alloy powder.SELECTED DRAWING: None 【課題】従来公知の銀被覆銅ニッケル亜鉛合金粉末を含む導電性ペーストよりも更に半田濡れ性に優れた導電膜を形成しうる導電性ペーストの材料（金属粉末）を提供すること。【解決手段】合金粒子と、該合金粒子を被覆する銀被覆層と、前記合金粒子及び銀被覆層で構成される銀被覆合金粒子を被覆する表面処理層とからなる表面処理銀被覆合金粉末であって、前記合金粒子が、銅、ニッケル、亜鉛及び不可避不純物からなり、前記表面処理銀被覆合金粉末について、半田濡れ性試験を行ったときに、半田伸縮率が６％以上である、表面処理銀被覆合金粉末。【選択図】なし