ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

• Main Author: TADAKI SHINJI
• Format: Patent
• Language: English; Japanese
• Published: 11.10.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a joining technology with high alignment accuracy and high connection reliability.SOLUTION: An electronic device includes: a first object to be joined; a second object to be joined which is laminated on the first object to be joined; and a first junction to join the first object to be joined and the second object to be joined. The first junction includes: a metal body in which molten metal is impregnated into the inside of porous metal that is arranged on the first object to be joined; a metal pillar connected to the second object to be joined; and a molten metal layer to connect between the metal body and the metal pillar.SELECTED DRAWING: Figure 1 【課題】高い位置合わせ精度と接続信頼性を有する接合技術を提供する。【解決手段】電子装置は、第１の接合対象体と、前記第１の接合対象体の上に積層された第２の接合対象体と、前記第１の接合対象体と前記第２の接合対象体を接合する第１接合部とを有し、前記第１接合部は、前記第１の接合対象体に配置されたポーラス金属の内部に溶融金属が含浸された金属体と、前記第２の接合対象体に接続される金属ピラーと、前記金属体と前記金属ピラーの間を接続する溶融金属層とを有する。【選択図】図１