COATING TREATMENT DEVICE AND CUP

• Main Authors: KAWAKAMI KOHEI, HATAKEYAMA SHINICHI
• Format: Patent
• Language: English; Japanese
• Published: 04.10.2018
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

PROBLEM TO BE SOLVED: To prevent scattering of a coating liquid onto a wafer surface after the coating liquid bounces on an air flow control plate disposed in a cup in a coating treatment device for coating a substrate with the coating liquid by a rotary system.SOLUTION: A resist coating device includes a cup that accommodates a spin chuck 121 and is evacuated through a bottom part. The cup has an air flow control part 151 that is located on a side closer to the top than a wafer W held by the spin chuck 121 and encloses an outer periphery of the wafer, and a support part 153 that supports the air flow control part 151. The support part 153 has one end connected to the inner circumference surface of the cup 125 and the other end located on a side closer to the top side than the one end and connected to the air flow control part 151, and the support part is provided with a first hole 153a shaped by cutting out in a direction perpendicular to the rotation axis of the wafer W, and a second hole 153b shaped by cutting out in the direction of the rotation axis of the wafer W, outside and below the first hole 153a.SELECTED DRAWING: Figure 9 【課題】回転式で基板上に塗布液を塗布する塗布処理装置において、カップ内に設けた気流制御板で塗布液が跳ね返ってウェハの表面に飛散するのを防止する【解決手段】レジスト塗布装置、スピンチャック１２１を収容し、底部から排気されるカップを備え、カップは、スピンチャック１２１に保持されたウェハＷより頂部側に位置し、該ウェハＷの外周を囲う気流制御部１５１と、気流制御部１５１を支持する支持部１５３とを有し、支持部１５３は、一方の端部がカップ１２５の内周面に接続され、他方の端部が上記一方の端部より頂部側に位置すると共に気流制御部１５１に接続され、ウェハＷの回転軸とは垂直な方向に抜かれた形状の第１の孔１５３ａが設けられ、ウェハＷの回転軸方向に抜かれた形状の第２の孔１５３ｂが該第１の孔１５３ａより外側下方に設けられている。【選択図】図９