RESIN COMPOSITION AND CROSSLINKED BODY OF THE SAME

• Main Authors: SAITO JUNJI, ASAHINA KOTARO, MURASE HIROHIKO, SAITO HARUKA
• Format: Patent
• Language: English; Japanese
• Published: 09.08.2018
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

PROBLEM TO BE SOLVED: To provide a resin composition capable of obtaining a crosslinked body excellent in dielectric characteristics, heat resistance and mechanical characteristics in a high frequency region suitable for an interlayer insulation film for circuit board and a circuit board for a highly integrated arithmetic device.SOLUTION: A resin composition contains a cyclic olefin copolymer (P), and one or two or more resins (Q) selected from the group consisting of polyphenylene ether, a polyimide resin, polyurethane, polyether ether ketone, polybutylene terephthalate, a liquid crystal polymer, a maleimide resin and a polybutadiene resin. A mass ratio ((Q)/(P)) of the content of the resin (Q) to the content of the cyclic olefin copolymer (P) in the resin composition is 0.1 or more and 5 or less.SELECTED DRAWING: None 【課題】高集積化演算装置に向けた回路基板用の層間絶縁フィルムおよび回路基板等に好適な高周波領域での誘電特性、耐熱性および機械的特性に優れた架橋体を得ることが可能な樹脂組成物を提供する。【解決手段】本発明の樹脂組成物は、環状オレフィン共重合体（Ｐ）と、ポリフェニレンエーテル、ポリイミド樹脂、ポリウレタン、ポリエーテルエーテルケトン、ポリブチレンテレフタレート、液晶ポリマー、マレイミド樹脂、およびポリブタジエン樹脂からなる群から選択される１種または２種以上の樹脂（Ｑ）と、を含む。そして、当該樹脂組成物中の環状オレフィン共重合体（Ｐ）の含有量に対する前記樹脂（Ｑ）の含有量の質量比（（Ｑ）／（Ｐ））が０．１以上５以下である。【選択図】なし