OBJECT PROCESSING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

• Main Authors: OKITA KENZO, MARUYAMA YOICHIRO
• Format: Patent
• Language: English; Japanese
• Published: 14.06.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide an object processing method that can suppress occurrence of high heat due to laser irradiation in a separation layer in a method in which a target processing and movement are performed in a state in which an object is temporarily fixed on a support body.SOLUTION: An...