ULTRASONIC JOINING APPARATUS

• Main Authors: UEHARA KAZUNARI, YAMANE TOSHIMASA
• Format: Patent
• Language: English; Japanese
• Published: 31.05.2018
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide an ultrasonic joining apparatus capable of separating surely a joined body from a chip after being joined thereto, even if joining work is performed repeatedly.SOLUTION: In an ultrasonic joining apparatus 1, a horn 9 is lowered by a lifting machine 5, and both aluminum alloy plates W1 are pinched by an amble 3 and a chip 10, and the horn 9 is vibrated by a vibration unit 7, to thereby perform ultrasonic joining. A slide member 11 slidable in a vertical direction is provided inside the chip 10. A coil spring 12 is slid downward by pressing the slide member 11 downward, and its lower end part is allowed to jump out from a lower end part of the chip 10.SELECTED DRAWING: Figure 6 【課題】接合作業を繰り返し行っても、接合後に被接合体をチップから確実に切り離すことができる超音波接合装置を提供する。【解決手段】超音波接合装置１は、昇降機５によりホーン９を下降させて両アルミニウム合金板Ｗ１をアンブル３とチップ１０とで挟み込むとともに、振動ユニット７によりホーン９を振動させて超音波接合を行う。チップ１０の内側には、上下方向にスライド可能なスライド部材１１が設けられる。コイルバネ１２はスライド部材１１を下方に押圧することにより下方にスライドさせてその下端部分をチップ１０の下端部分から飛び出させる。【選択図】図６